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Hon Precision Q3 2026 Investor Presentation

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Hon Precision (鴻勁精密, TWSE: 7769) Q3 2026 Investor Presentation — the English deck filed on Taiwan's Market Observation Post System (MOPS) for the company's October 2026 online investor conference (法說會) hosted by Cathay Securities. Hon Precision makes semiconductor test handlers and active thermal control (ATC) systems. The 17-slide deck covers profitability (Q3 2026 revenue of NT$ (New Taiwan dollars) 16.19 billion, nearly double the NT$8.20 billion of Q3 2025; 9M 2026 EPS of NT$93.47, already above full-year 2025's NT$75.71), an order mix now 78% AI / HPC / ASIC, and product updates: the ATC cooling roadmap up to 25 kW, Mega Tray FT and SLT handlers for packages larger than 120 x 150 mm, a Handler + AMR automation line running at a Taiwan OSAT, and test solutions for co-packaged optics (CPO) and co-packaged copper (CPC).

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Hon Precision
鴻勁精密
TWSE 7769
Investor presentation
Q3 2026 earnings

分享幻燈片

描述

主要主題

Hon Precision (鴻勁精密, TWSE: 7769) Q3 2026 Investor Presentation — the English deck filed on Taiwan's Market Observation Post System (MOPS) for the company's October 2026 online investor conference (法說會) hosted by Cathay Securities. Hon Precision makes semiconductor test handlers and active thermal control (ATC) systems. The 17-slide deck covers profitability (Q3 2026 revenue of NT$ (New Taiwan dollars) 16.19 billion, nearly double the NT$8.20 billion of Q3 2025; 9M 2026 EPS of NT$93.47, already above full-year 2025's NT$75.71), an order mix now 78% AI / HPC / ASIC, and product updates: the ATC cooling roadmap up to 25 kW, Mega Tray FT and SLT handlers for packages larger than 120 x 150 mm, a Handler + AMR automation line running at a Taiwan OSAT, and test solutions for co-packaged optics (CPO) and co-packaged copper (CPC).

主要優勢

  • •Full Q3 2026 and 9M 2026 income statement in NT$ thousands with margins for each line, compared with Q3 2025 and Q2 2026
  • •Three-year view of revenue, gross margin and EPS (2024, 2025, 9M 2026) plus a six-quarter margin trend chart
  • •Order mix by end market showing AI / HPC / ASIC rising to 78% of 9M 2026 orders from 72% in 2025
  • •Product roadmap for thermal control (ATC 3 / 5 / 8 series, 12 kW next generation in Q4 2026, 25 kW in Q4 2027)
  • •Clear view of how test handlers are adapting to very large AI packages, mega trays, CPO and CPC

目標受眾

  • •Investors and analysts following Taiwan-listed semiconductor equipment and AI supply-chain companies
  • •Semiconductor back-end and test engineers tracking handler and thermal-control technology for AI accelerators
  • •Equity research teams comparing test-handler makers (Hon Precision, Advantest, Cohu and peers)
  • •Investor relations teams at Taiwan companies preparing English 法說會 materials
  • •Students and researchers studying the AI chip test and packaging ecosystem

使用場景

  • •Pulling Hon Precision's Q3 2026 revenue, margins, net income and EPS for a model or earnings note
  • •Tracking how much of a semiconductor equipment maker's orders come from AI / HPC
  • •Reference for a technology briefing on active thermal control, mega-tray handling and CPO / CPC test
  • •Template reference for a compact quarterly investor-conference deck with section tabs and a three-part agenda
  • •Benchmarking Taiwan investor conference disclosure style and level of detail

獨特價值主張

  • •Primary-source English deck from MOPS, with figures read directly from each slide
  • •Combines financials and hardware roadmap in only 17 slides
  • •Shows the thermal and package-size demands of AI chips from the test-equipment side
  • •Consistent visual system: blue / red brand palette, top section tabs, hexagon agenda icons and full-bleed section dividers

幻燈片頁面 (17)

每張幻燈片頁面的詳細視圖,包括版面、關鍵內容和視覺元素。

頁面 1
title slide

Cover: 2026Q3 Investor Presentation (2026/10)

內容

Title slide for Hon. Precision, Inc. (鴻勁精密股份有限公司), ticker TWSE 7769, reading '2026Q3 Investor Presentation (2026/10)', with a photo of the company headquarters building and the HON.PREC logo.

版面結構

Logo top left, ticker label and large spaced-out title on the left half, faded full-bleed building photograph on the right half, vertical '2026Q3 Investor Presentation' strip along the left edge, copyright footer.

關鍵視覺元素

  • •HON.PREC red and blue logo with Chinese company name
  • •Headquarters building photo with sky
  • •Red 'TWSE 7769' label
  • •Vertical red side text with three red dots
頁面 2
disclaimer

Safe Harbor Notice

內容

Standard forward-looking statements disclaimer: projections, targets, estimates and business plans are forward-looking; actual results may differ due to market demand, price fluctuations, competition, changes in legal and government policies, financial market conditions and other factors; the company undertakes no obligation to update them.

版面結構

Bold blue heading with underline accent, three justified paragraphs of body text filling the slide, page number bottom right.

關鍵視覺元素

  • •Blue headline with red dot bullet mark
  • •Justified text block
  • •Footer copyright line
頁面 3
agenda

Agenda

內容

Three-part agenda: 01 Profitability, 02 Product Mix, 03 Key Developments. These three items also appear as navigation tabs in the top right of every content slide.

版面結構

Three hexagon-cropped images in a row (stock chart, headquarters building, hand on a holographic circuit tablet), each above a colored numbered pill (teal, red, yellow) and an italic label.

關鍵視覺元素

  • •Hexagon image frames with colored glow
  • •Numbered pills 01 / 02 / 03
  • •Top-right section tab navigation with 'Profitability' highlighted
頁面 4
section divider

Section Divider: Profitability

內容

Section opener for Profitability, listing two sub-topics: Profit Trends and Financial Statements.

版面結構

Large bold heading and two bullets on the white left side; right side is a stock-ticker chart photograph inside a sweeping blue arc.

關鍵視覺元素

  • •Blue curved arc framing a financial-market screen photo
  • •Large black section title
  • •Bullet list of sub-topics
頁面 5
data visualization

Profit Trends

內容

Table of revenue (NT$ thousands), gross margin and EPS (NT$): 9M 2026 (Q1–Q3) revenue 40,713,157, gross margin 56.46%, EPS 93.47; full-year 2025 revenue 30,270,625, gross margin 56.54%, EPS 75.71; full-year 2024 revenue 13,992,344, gross margin 55.02%, EPS 32.95. A line chart tracks gross, operating and net margin from 25Q2 to 26Q3: gross margin stays roughly in the mid-to-high 50s (dipping near 52% in 25Q4), operating margin roughly 44–53%, and net margin roughly 36–44%; exact per-quarter values are not labelled on the chart.

版面結構

Left: three-row comparison table with the 9M 2026 row highlighted in red on pink; right: three-series line chart with legend and quarter labels.

關鍵視覺元素

  • •Highlighted red current-period row
  • •Pink / purple / cyan margin lines
  • •Quarterly x-axis 25Q2–26Q3
頁面 6
financial table

Financial Statements

內容

Condensed income statement in NT$ thousands. Q3 2026: revenue 16,194,191; gross profit 9,220,033 (56.9%); operating expenses 1,178,581 (7.3%); operating profit 8,041,452 (49.7%); net income 6,716,581 (41.5%). Q2 2026: revenue 13,793,769; gross profit 7,736,594 (56.1%); opex 1,050,389 (7.6%); operating profit 6,686,205 (48.5%); net income 5,476,251 (39.7%). Q3 2025: revenue 8,197,806; gross profit 4,730,231 (57.7%); opex 564,718 (6.9%); operating profit 4,165,513 (50.8%); net income 3,616,875 (44.1%). 9M 2026: revenue 40,713,157; gross profit 22,988,337 (56.5%); opex 2,900,629 (7.1%); operating profit 20,087,708 (49.3%); net income 16,817,098 (41.3%). Q3 revenue was up about 98% year on year and about 17% quarter on quarter.

版面結構

Wide comparison table: row labels on the left, then column pairs for 25Q3 (teal), 26Q2 (lavender), 26Q3 (pale pink) and 26Q1~Q3 (bold red block), each with value and percentage-of-revenue columns; unit note 'NT$ thousands' above.

關鍵視覺元素

  • •Color-coded period columns
  • •Bold red cumulative 9M block
  • •Percentage-of-revenue columns
頁面 7
section divider

Section Divider: Product Mix

內容

Section opener for Product Mix with one sub-topic: Order Mix.

版面結構

Same divider layout as page 4: title and bullet on the left, headquarters building photograph inside a blue arc on the right; 'Product Mix' tab underlined.

關鍵視覺元素

  • •Blue arc with building photo
  • •Large section title
  • •Highlighted navigation tab
頁面 8
market segmentation

Order Mix

內容

9M 2026 order mix by end market: AI / HPC / ASIC 78% (up from 72% in 2025; AI computing, server, networking, APU/GPU/CPU/FPGA); Automotive 9% (down from 11%; sensor, MCU, LiDAR); Mobile AP / Communication 7% (down from 10%; SiP, 5G OTA, power/PMIC, mobile phone/AP, RF devices); 3C Consumer 4% (down from 5%; AR glasses, LCD driver, CIS); Memory / MEMS 2% (flat at 2%; Flash/DRAM, accelerometer, gyroscope, barometer, light sensor, pressure sensor).

版面結構

Five equal vertical cards, each with a themed photo of a handler machine and a colored title, a large percentage, the change versus 2025 with an up / down / flat arrow, and a bullet list of applications; each card has a colored bottom bar.

關鍵視覺元素

  • •Five product cards with equipment photos
  • •Large colored percentages
  • •Trend arrows vs 2025
  • •Color-coded bottom borders
頁面 9
section divider

Section Divider: Key Developments

內容

Section opener for Key Developments listing four topics: ATC Roadmap, Mega Tray Solution, CPO Solution and CPC Solution.

版面結構

Divider layout with a yellow arc framing a photo of an engineer working on test equipment; title and four bullets on the left.

關鍵視覺元素

  • •Yellow-green arc
  • •Engineer and machine close-up photo
  • •Four-item bullet list
頁面 10
product roadmap

Key Update: ATC Roadmap — Innovative Cooling for Next-Generation Testing Solution

內容

Active thermal control roadmap. Headline specs: power density from 100 to 500 W/cm², temperature range -70 to 175°C, cooling capacity from 1.5 kW to 25 kW. Liquid-cooled ATC 3 series (rapid temperature ramping, ~10 kW) covers roughly 25–125°C. Refrigerant-based ATC 8 series (high power, ~25 kW) covers -10 to 125°C with options down to -40°C and up to 175°C; ATC 5 series (full-range temperature control, ~10 kW) covers -70 to 125°C with an option up to 175°C. Next generation 12 kW (200 x 200 mm) in Q4 2026, then 25 kW future innovation in Q4 2027. Target applications: AI GPU & CPU, AI accelerators (HPC), CPC, NPO and CPO / silicon photonics.

版面結構

Horizontal temperature arrow from blue (-70°C) to red (175°C) in the middle; liquid product image and ATC 3 bar above, refrigerant product image with ATC 8 and ATC 5 bars below; three spec callout boxes at top; application icon strip and two-step timeline boxes at the bottom.

關鍵視覺元素

  • •Gradient temperature axis
  • •Colored series bars with option extensions
  • •Spec callout icons (chart, thermometer, snowflake)
  • •Next Generation → Future Innovation timeline tags
頁面 11
product feature

Key Update: Mega Tray Solution — FT (HP-9050, HP-1050)

內容

New-model final-test (FT) handlers HP-9050 and HP-1050 for large packages over 120 x 150 mm. Mega tray formats: tray 380 x 387.6 mm with IC 360 x 360 mm, and tray 258 x 537.6 mm with IC 240 x 360 mm. Paired with full automation (option supporting OHT / AMR / lot cascade), the latest ATC system (ATC 3.7 / 8.5) and multi-AOI solutions for improved integrity.

版面結構

Left: product photo in a circular frame with a yellow 'New Model' hexagon and a spec box below; center plus sign; right: three hexagon feature badges (Full Automation, ATC System, Multi AOI Solutions) with short captions.

關鍵視覺元素

  • •Handler machine photo
  • •Yellow 'New Model' badge
  • •Blue, dark red and grey hexagon feature icons
  • •Mega tray and IC spec box
頁面 12
product feature

Key Update: Mega Tray Solution — SLT (HP-3036), Support Up to 36 Test Sites

內容

New-model system-level test (SLT) handler HP-3036 for large packages over 120 x 150 mm, supporting up to 36 test sites. Same mega tray formats as the FT models (380 x 387.6 mm tray / 360 x 360 mm IC; 258 x 537.6 mm tray / 240 x 360 mm IC), full automation option with OHT / AMR / lot cascade, latest ATC system (ATC 3.7 / 8.5) and multi-AOI solutions.

版面結構

Mirrors page 11: product photo with 'New Model' badge and spec box on the left, plus sign, three hexagon feature badges on the right, red subtitle highlighting 36 test sites.

關鍵視覺元素

  • •SLT handler photo with multiple test chambers
  • •Red '36 Test Sites' subtitle
  • •Hexagon feature badges
頁面 13
case study / solution

Mega Tray FT/SLT ATC Handler with Automation Solution

內容

Handler + AMR: a row of HP-9050 handlers served by an autonomous mobile robot with a robotic arm. The solution has been implemented with a Taiwan OSAT and reduces manpower.

版面結構

3D render of three handlers in a line on a tiled floor with an AMR at the end; right side has a bordered 'Handler+AMR' label and two bullets with a people icon and red down arrow.

關鍵視覺元素

  • •Perspective render of handler line
  • •AMR with robot arm
  • •Manpower-saving icon with downward arrow
頁面 14
technical diagram

Key Update: CPO — INS4 OE Solution

內容

Test stack for co-packaged optics: from bottom up, ATE tester, load board, socket, substrate with optical engines (OE) and ASIC, cold plate and thermal system. An external laser source (ELS) feeds light through fiber to a fiber array unit (FAU), with an optical alignment stage on top; an inset shows several OE chiplets around an ASIC on the package.

版面結構

Colorful layered block diagram in the center, circular photo callouts on the left for the optical alignment stage, ELS instrument and test board, and a zoomed package inset on the right linked by a red arrow.

關鍵視覺元素

  • •Stacked 3D layer blocks
  • •Dashed red box around OE/ASIC/substrate
  • •Fiber link from FAU
  • •OE-ASIC package inset
頁面 15
technical diagram

Key Update: CPC Solution

內容

Co-packaged copper test fixture: a chuck with alignment pins plus top sockets without alignment pins, with shims between them. An exploded view labels top socket, shim, alignment pin (installed on the chuck) and chuck; a render on the right shows an ASIC surrounded by copper cable connectors.

版面結構

One bullet at top; exploded-view CAD drawing with labeled callout arrows on the left; rendered ASIC with blue cable assemblies on the right.

關鍵視覺元素

  • •Exploded mechanical drawing
  • •Callout labels with red arrows
  • •ASIC with blue copper cable bundles
頁面 16
closing statement

Smarter Chips. Efficient Tomorrow. Powered by Our Growth Drivers.

內容

Closing tagline slide: 'Smarter Chips. Efficient Tomorrow.' with the red italic line 'Powered by Our Growth Drivers.'

版面結構

Centered large two-line statement with a red italic third line over a faded circuit-board trace background in blue and red; full logo top left.

關鍵視覺元素

  • •Circuit trace graphics
  • •Large bold tagline
  • •Red italic emphasis line
頁面 17
Q&A / conclusion

Questions & Answers

內容

Q&A slide for the investor conference, showing only 'Questions & Answers' and the company logo.

版面結構

Centered title on a light hexagon-patterned background, logo top left, copyright footer.

關鍵視覺元素

  • •Large centered heading
  • •Subtle hexagon background
  • •Bilingual logo

常見問題

關於此幻燈片和基礎簡報內容的常見問題。

Where does this Hon Precision Q3 2026 investor presentation come from?

It is the English-language deck Hon Precision (鴻勁精密, TWSE: 7769) filed on Taiwan's Market Observation Post System (MOPS) for its Q3 2026 investor conference (法說會), an online session hosted by Cathay Securities in October 2026. A Chinese version is also filed on MOPS; this page uses the English one.

What were Hon Precision's Q3 2026 revenue and profit?

Q3 2026 revenue was NT$ (New Taiwan dollars) 16,194,191 thousand, about NT$16.2 billion, up roughly 98% from NT$8.2 billion in Q3 2025 and about 17% from Q2 2026. Gross margin was 56.9%, operating margin 49.7% and net income NT$6.72 billion (41.5% of revenue).

How did the first nine months of 2026 compare with full-year 2025?

9M 2026 revenue reached NT$40.71 billion with EPS of NT$93.47, already above full-year 2025 revenue of NT$30.27 billion and EPS of NT$75.71. 2024 revenue was NT$13.99 billion with EPS of NT$32.95.

How much of Hon Precision's business comes from AI?

AI / HPC / ASIC made up 78% of the 9M 2026 order mix, up from 72% in 2025. Automotive was 9%, mobile AP / communication 7%, 3C consumer 4% and memory / MEMS 2%.

What new products does the deck introduce?

New Mega Tray handlers for packages larger than 120 x 150 mm: the HP-9050 and HP-1050 for final test and the HP-3036 for system-level test with up to 36 test sites. It also shows the ATC thermal control roadmap (12 kW next generation in Q4 2026, 25 kW in Q4 2027), a Handler + AMR automation line running at a Taiwan OSAT, and test solutions for CPO and CPC.

What is ATC and why does it matter for AI chips?

ATC (active thermal control) holds a chip at a set temperature while it is tested. AI GPUs and accelerators dissipate so much power that the handler must remove heat quickly; the deck targets power density rising from 100 to 500 W/cm², cooling capacity up to 25 kW and a range of -70°C to 175°C.

Can I download this deck?

Yes. The original 17-page PDF is available to download from this page, and each slide is also shown as an image with a written summary below.

Can I use this deck as a template for my own investor conference?

It is a useful structural reference: cover, safe harbor, three-part agenda, divider slides per section, financial tables, an order-mix card layout and product update slides, with section tabs on every page. The content and branding belong to Hon Precision, so build your own deck with your own data.

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