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Hon Precision (鴻勁精密, TWSE: 7769) Q3 2026 Investor Presentation — the English deck filed on Taiwan's Market Observation Post System (MOPS) for the company's October 2026 online investor conference (法說會) hosted by Cathay Securities. Hon Precision makes semiconductor test handlers and active thermal control (ATC) systems. The 17-slide deck covers profitability (Q3 2026 revenue of NT$ (New Taiwan dollars) 16.19 billion, nearly double the NT$8.20 billion of Q3 2025; 9M 2026 EPS of NT$93.47, already above full-year 2025's NT$75.71), an order mix now 78% AI / HPC / ASIC, and product updates: the ATC cooling roadmap up to 25 kW, Mega Tray FT and SLT handlers for packages larger than 120 x 150 mm, a Handler + AMR automation line running at a Taiwan OSAT, and test solutions for co-packaged optics (CPO) and co-packaged copper (CPC).
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Hon Precision (鴻勁精密, TWSE: 7769) Q3 2026 Investor Presentation — the English deck filed on Taiwan's Market Observation Post System (MOPS) for the company's October 2026 online investor conference (法說會) hosted by Cathay Securities. Hon Precision makes semiconductor test handlers and active thermal control (ATC) systems. The 17-slide deck covers profitability (Q3 2026 revenue of NT$ (New Taiwan dollars) 16.19 billion, nearly double the NT$8.20 billion of Q3 2025; 9M 2026 EPS of NT$93.47, already above full-year 2025's NT$75.71), an order mix now 78% AI / HPC / ASIC, and product updates: the ATC cooling roadmap up to 25 kW, Mega Tray FT and SLT handlers for packages larger than 120 x 150 mm, a Handler + AMR automation line running at a Taiwan OSAT, and test solutions for co-packaged optics (CPO) and co-packaged copper (CPC).
Detaillierte Ansicht jeder Folien-Seite, einschließlich Layout, wichtigem Inhalt und visuellen Elementen.
Title slide for Hon. Precision, Inc. (鴻勁精密股份有限公司), ticker TWSE 7769, reading '2026Q3 Investor Presentation (2026/10)', with a photo of the company headquarters building and the HON.PREC logo.
Logo top left, ticker label and large spaced-out title on the left half, faded full-bleed building photograph on the right half, vertical '2026Q3 Investor Presentation' strip along the left edge, copyright footer.
Standard forward-looking statements disclaimer: projections, targets, estimates and business plans are forward-looking; actual results may differ due to market demand, price fluctuations, competition, changes in legal and government policies, financial market conditions and other factors; the company undertakes no obligation to update them.
Bold blue heading with underline accent, three justified paragraphs of body text filling the slide, page number bottom right.
Three-part agenda: 01 Profitability, 02 Product Mix, 03 Key Developments. These three items also appear as navigation tabs in the top right of every content slide.
Three hexagon-cropped images in a row (stock chart, headquarters building, hand on a holographic circuit tablet), each above a colored numbered pill (teal, red, yellow) and an italic label.
Section opener for Profitability, listing two sub-topics: Profit Trends and Financial Statements.
Large bold heading and two bullets on the white left side; right side is a stock-ticker chart photograph inside a sweeping blue arc.
Table of revenue (NT$ thousands), gross margin and EPS (NT$): 9M 2026 (Q1–Q3) revenue 40,713,157, gross margin 56.46%, EPS 93.47; full-year 2025 revenue 30,270,625, gross margin 56.54%, EPS 75.71; full-year 2024 revenue 13,992,344, gross margin 55.02%, EPS 32.95. A line chart tracks gross, operating and net margin from 25Q2 to 26Q3: gross margin stays roughly in the mid-to-high 50s (dipping near 52% in 25Q4), operating margin roughly 44–53%, and net margin roughly 36–44%; exact per-quarter values are not labelled on the chart.
Left: three-row comparison table with the 9M 2026 row highlighted in red on pink; right: three-series line chart with legend and quarter labels.
Condensed income statement in NT$ thousands. Q3 2026: revenue 16,194,191; gross profit 9,220,033 (56.9%); operating expenses 1,178,581 (7.3%); operating profit 8,041,452 (49.7%); net income 6,716,581 (41.5%). Q2 2026: revenue 13,793,769; gross profit 7,736,594 (56.1%); opex 1,050,389 (7.6%); operating profit 6,686,205 (48.5%); net income 5,476,251 (39.7%). Q3 2025: revenue 8,197,806; gross profit 4,730,231 (57.7%); opex 564,718 (6.9%); operating profit 4,165,513 (50.8%); net income 3,616,875 (44.1%). 9M 2026: revenue 40,713,157; gross profit 22,988,337 (56.5%); opex 2,900,629 (7.1%); operating profit 20,087,708 (49.3%); net income 16,817,098 (41.3%). Q3 revenue was up about 98% year on year and about 17% quarter on quarter.
Wide comparison table: row labels on the left, then column pairs for 25Q3 (teal), 26Q2 (lavender), 26Q3 (pale pink) and 26Q1~Q3 (bold red block), each with value and percentage-of-revenue columns; unit note 'NT$ thousands' above.
Section opener for Product Mix with one sub-topic: Order Mix.
Same divider layout as page 4: title and bullet on the left, headquarters building photograph inside a blue arc on the right; 'Product Mix' tab underlined.
9M 2026 order mix by end market: AI / HPC / ASIC 78% (up from 72% in 2025; AI computing, server, networking, APU/GPU/CPU/FPGA); Automotive 9% (down from 11%; sensor, MCU, LiDAR); Mobile AP / Communication 7% (down from 10%; SiP, 5G OTA, power/PMIC, mobile phone/AP, RF devices); 3C Consumer 4% (down from 5%; AR glasses, LCD driver, CIS); Memory / MEMS 2% (flat at 2%; Flash/DRAM, accelerometer, gyroscope, barometer, light sensor, pressure sensor).
Five equal vertical cards, each with a themed photo of a handler machine and a colored title, a large percentage, the change versus 2025 with an up / down / flat arrow, and a bullet list of applications; each card has a colored bottom bar.
Section opener for Key Developments listing four topics: ATC Roadmap, Mega Tray Solution, CPO Solution and CPC Solution.
Divider layout with a yellow arc framing a photo of an engineer working on test equipment; title and four bullets on the left.
Active thermal control roadmap. Headline specs: power density from 100 to 500 W/cm², temperature range -70 to 175°C, cooling capacity from 1.5 kW to 25 kW. Liquid-cooled ATC 3 series (rapid temperature ramping, ~10 kW) covers roughly 25–125°C. Refrigerant-based ATC 8 series (high power, ~25 kW) covers -10 to 125°C with options down to -40°C and up to 175°C; ATC 5 series (full-range temperature control, ~10 kW) covers -70 to 125°C with an option up to 175°C. Next generation 12 kW (200 x 200 mm) in Q4 2026, then 25 kW future innovation in Q4 2027. Target applications: AI GPU & CPU, AI accelerators (HPC), CPC, NPO and CPO / silicon photonics.
Horizontal temperature arrow from blue (-70°C) to red (175°C) in the middle; liquid product image and ATC 3 bar above, refrigerant product image with ATC 8 and ATC 5 bars below; three spec callout boxes at top; application icon strip and two-step timeline boxes at the bottom.
New-model final-test (FT) handlers HP-9050 and HP-1050 for large packages over 120 x 150 mm. Mega tray formats: tray 380 x 387.6 mm with IC 360 x 360 mm, and tray 258 x 537.6 mm with IC 240 x 360 mm. Paired with full automation (option supporting OHT / AMR / lot cascade), the latest ATC system (ATC 3.7 / 8.5) and multi-AOI solutions for improved integrity.
Left: product photo in a circular frame with a yellow 'New Model' hexagon and a spec box below; center plus sign; right: three hexagon feature badges (Full Automation, ATC System, Multi AOI Solutions) with short captions.
New-model system-level test (SLT) handler HP-3036 for large packages over 120 x 150 mm, supporting up to 36 test sites. Same mega tray formats as the FT models (380 x 387.6 mm tray / 360 x 360 mm IC; 258 x 537.6 mm tray / 240 x 360 mm IC), full automation option with OHT / AMR / lot cascade, latest ATC system (ATC 3.7 / 8.5) and multi-AOI solutions.
Mirrors page 11: product photo with 'New Model' badge and spec box on the left, plus sign, three hexagon feature badges on the right, red subtitle highlighting 36 test sites.
Handler + AMR: a row of HP-9050 handlers served by an autonomous mobile robot with a robotic arm. The solution has been implemented with a Taiwan OSAT and reduces manpower.
3D render of three handlers in a line on a tiled floor with an AMR at the end; right side has a bordered 'Handler+AMR' label and two bullets with a people icon and red down arrow.
Test stack for co-packaged optics: from bottom up, ATE tester, load board, socket, substrate with optical engines (OE) and ASIC, cold plate and thermal system. An external laser source (ELS) feeds light through fiber to a fiber array unit (FAU), with an optical alignment stage on top; an inset shows several OE chiplets around an ASIC on the package.
Colorful layered block diagram in the center, circular photo callouts on the left for the optical alignment stage, ELS instrument and test board, and a zoomed package inset on the right linked by a red arrow.
Co-packaged copper test fixture: a chuck with alignment pins plus top sockets without alignment pins, with shims between them. An exploded view labels top socket, shim, alignment pin (installed on the chuck) and chuck; a render on the right shows an ASIC surrounded by copper cable connectors.
One bullet at top; exploded-view CAD drawing with labeled callout arrows on the left; rendered ASIC with blue cable assemblies on the right.
Closing tagline slide: 'Smarter Chips. Efficient Tomorrow.' with the red italic line 'Powered by Our Growth Drivers.'
Centered large two-line statement with a red italic third line over a faded circuit-board trace background in blue and red; full logo top left.
Q&A slide for the investor conference, showing only 'Questions & Answers' and the company logo.
Centered title on a light hexagon-patterned background, logo top left, copyright footer.
Häufige Fragen zu dieser Folie und dem zugrunde liegenden Präsentationsinhalt.
It is the English-language deck Hon Precision (鴻勁精密, TWSE: 7769) filed on Taiwan's Market Observation Post System (MOPS) for its Q3 2026 investor conference (法說會), an online session hosted by Cathay Securities in October 2026. A Chinese version is also filed on MOPS; this page uses the English one.
Q3 2026 revenue was NT$ (New Taiwan dollars) 16,194,191 thousand, about NT$16.2 billion, up roughly 98% from NT$8.2 billion in Q3 2025 and about 17% from Q2 2026. Gross margin was 56.9%, operating margin 49.7% and net income NT$6.72 billion (41.5% of revenue).
9M 2026 revenue reached NT$40.71 billion with EPS of NT$93.47, already above full-year 2025 revenue of NT$30.27 billion and EPS of NT$75.71. 2024 revenue was NT$13.99 billion with EPS of NT$32.95.
AI / HPC / ASIC made up 78% of the 9M 2026 order mix, up from 72% in 2025. Automotive was 9%, mobile AP / communication 7%, 3C consumer 4% and memory / MEMS 2%.
New Mega Tray handlers for packages larger than 120 x 150 mm: the HP-9050 and HP-1050 for final test and the HP-3036 for system-level test with up to 36 test sites. It also shows the ATC thermal control roadmap (12 kW next generation in Q4 2026, 25 kW in Q4 2027), a Handler + AMR automation line running at a Taiwan OSAT, and test solutions for CPO and CPC.
ATC (active thermal control) holds a chip at a set temperature while it is tested. AI GPUs and accelerators dissipate so much power that the handler must remove heat quickly; the deck targets power density rising from 100 to 500 W/cm², cooling capacity up to 25 kW and a range of -70°C to 175°C.
Yes. The original 17-page PDF is available to download from this page, and each slide is also shown as an image with a written summary below.
It is a useful structural reference: cover, safe harbor, three-part agenda, divider slides per section, financial tables, an order-mix card layout and product update slides, with section tabs on every page. The content and branding belong to Hon Precision, so build your own deck with your own data.
Original English investor conference deck filed by Hon Precision (TWSE: 7769)
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