수록 모음: 투자자 발표자료 사례 · 일본 기업 IR 자료 예시 · 반도체 기업 IR 자료 예시
ROHM Co., Ltd. (TSE 6963) FY2026 1H Earnings Presentation (FY2026 1H 決算説明会), dated November 6, 2026: first-half sales of ¥279.5 billion (2,795 億円, +14.4% YoY), operating profit of 175 億円 (+128.5%), and a full-year forecast raised to 5,500 億円 sales and 500 億円 operating profit. This is a Japanese-language deck originally published on TDnet (Tokyo Stock Exchange Timely Disclosure); slide titles and key figures are translated into English on this page.
이 프레젠테이션의 표지를 스타일 참고 자료로 사용해 내 콘텐츠로 슬라이드를 만듭니다. 아래에서 원하는 페이지를 골라 그 레이아웃을 참고로 쓸 수도 있습니다.
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ROHM Co., Ltd. (TSE 6963) FY2026 1H Earnings Presentation (FY2026 1H 決算説明会), dated November 6, 2026: first-half sales of ¥279.5 billion (2,795 億円, +14.4% YoY), operating profit of 175 億円 (+128.5%), and a full-year forecast raised to 5,500 億円 sales and 500 億円 operating profit. This is a Japanese-language deck originally published on TDnet (Tokyo Stock Exchange Timely Disclosure); slide titles and key figures are translated into English on this page.
레이아웃, 주요 콘텐츠 및 시각적 요소를 포함한 각 슬라이드 페이지의 상세 보기.
Title slide for ROHM's FY2026 first-half results briefing, dated November 6, 2026, presented by Representative Director and President Katsumi Azuma.
Minimal white cover with the red ROHM Semiconductor logo and 'Electronics for the Future' tagline top-left, large title mid-left, date, company name and presenter bottom-left.
Section break opening the financial results part of the presentation.
White slide with a short red vertical bar next to a single centered-left section title.
1H sales 2,795 億円 (+14.4% YoY), operating profit 175 億円 (6.3% margin, +128.5%), net profit 156 億円 (+51.0%) at ¥160.02/US$; revised full-year plan of 5,500 億円 sales (+14.3%), 500 億円 operating profit (9.1%, +360.2%) and 450 億円 net profit at ¥156.78/US$. Commentary covers higher sales and lower depreciation offsetting material and energy costs, demand above expectations in automotive, industrial and servers, very high utilization, a 25-yen interim and 50-yen annual dividend (43% payout), and ongoing business integration talks.
Top: two-block KPI table (1H actual vs YoY, revised full-year plan vs YoY) with charcoal headers. Bottom: five labeled rows with red left accents and grey label cells, each followed by one or two lines of commentary.
1H sales rose from 2,442 億円 to 2,795 億円. By market: automotive 1,314 (47.0%, +15.2%), consumer 564 (20.2%, -5.5%), industrial 407 (14.6%, +32.6%), computers & storage 384 (13.7%, +28.5%), communications 126 (4.5%, +27.9%). By segment: LSI 1,288 (+12.8%), semiconductor devices 1,207 (+20.7%), modules 164 (-4.4%), others 136. By customer nationality: Japan 1,476 (+13.8%), Americas 364 (+29.5%), other Asia 358 (+47.4%), China 334 (-12.8%), Europe 263 (+10.4%).
Header banner comparing prior and current 1H sales with red YoY callout; three donut charts side by side with red value pills; a YoY table with inline mini bars under each donut.
Operating profit rose 98 億円, from 77 to 175 億円. Higher sales added +352 (FX +128, underlying +224; automotive +173, industrial +100, C&S +85, communications +28, consumer -33); materials and inventory effects cut -262 (materials -290, inventory +28) due to higher volumes, raw material prices and a temporary SiC yield issue; lower fixed costs added +8, helped by lower depreciation after last year's impairment and lower R&D as the 8-inch SiC line entered mass production.
Waterfall chart from FY2025 1H to FY2026 1H with stacked FX and underlying portions, numbered red callout boxes explaining each driver, summary tables under each bar and a large red arrow showing the 98 億円 increase.
SiC business sales (excluding substrates) grew 55% YoY in 1H, driven by steady automotive demand from European and Japanese customers and growing AI server adoption. Server-related sales grew 66% YoY, led by Si power devices, with capacity increases under way to meet further demand.
Two equal panels with charcoal header bars; each has a two-bar chart (FY25 1H vs FY26 1H), a red circular YoY badge, bullet commentary and a photo (EV drivetrain, server room).
Market outlook table: automotive +10.1% for the year (1H +15.2%, 2H +5.4%) with SiC growth in Europe and Japan leading xEV; industrial +29.1% (1H +32.6%, 2H +25.6%) as customer inventory adjustment ends and AI-server-related FA capex grows; servers +94.1% (1H +66.3%, 2H +121.4%) with orders exceeding capacity and a growing backlog; consumer and others +6.6% (1H +2.5%, 2H +11.4%) as China white goods fall back and amusement demand rises.
Four-row table with market names and full-year growth in the left column, outlook bullets in the middle and weather icons with 1H and 2H growth rates on the right; weather-icon legend at the bottom.
Full-year sales planned at 5,500 億円 vs 4,811 億円 actual in FY2025 (+14.3%). Market: automotive 2,608 (47.4%, +10.1%), consumer 1,075 (+1.9%), C&S 806 (+36.0%), industrial 792 (+29.1%), communications 220 (+20.1%). Segment: LSI 2,490 (+14.0%), semiconductor devices 2,457 (+19.7%), modules 305 (-3.5%), others 249 (-4.1%). Nationality: Japan 2,930 (+16.1%), other Asia 734 (+46.6%), Americas 668 (+19.4%), China 616 (-12.5%), Europe 552 (+5.2%).
Same template as page 4: header banner with prior-year and plan totals, three donut charts with red value pills, and YoY tables with mini bars.
Operating profit is planned to rise 391 億円, from 109 to 500 億円. Sales growth adds +688 (FX +110, underlying +578; C&S +213, automotive +239, industrial +178, communications +37, consumer +21) including gold-price pass-through and price increases; materials and inventory reduce profit by -333 (materials -250, inventory -83 as product inventory is cut); fixed costs fall by +36, mainly lower depreciation and R&D.
Waterfall chart from FY2025 actual to FY2026 revised plan with FX and underlying splits, three numbered callout boxes, driver tables beneath and a red arrow for the 391 億円 increase.
The operating profit forecast is raised by 200 億円, from an initial 300 to 500 億円. Higher sales add +400 (FX +62, underlying +338) as automotive, industrial and C&S demand exceed expectations and price increases extend to unprofitable products; materials and inventory reduce -233 (materials -140, inventory -93 as inventory falls faster than planned); fixed costs add +33 as the 8-inch SiC line ramp is brought forward and R&D falls.
Waterfall chart from initial plan to revised plan, same structure as page 9, with a red arrow labeled 200 億円 upward revision.
Capex history: FY21 799, FY22 1,261, FY23 1,867, FY24 1,330, FY25 824 億円. FY26 1H capex was 238 億円 (capacity 125, land and buildings 51, other 61); the FY26 plan of 600 億円 (capacity 318, land and buildings 131, other 151) is unchanged from the initial plan.
Stacked column chart by fiscal year with three categories, a narrower 1H bar next to a red-shaded FY26 plan bar, legend at top right and a red 'unchanged from initial plan' callout.
Quarterly inventory from FY24 1Q to FY26 2Q with months-on-hand lines. Finished goods fell to 329 億円 (0.9 months) as adjustment is complete; work in process stood at 984 億円 (2.7 months) with lead-time cuts planned; raw materials and supplies fell to 670 億円 (1.9 months) as LTA purchase volumes are reduced. Dashed bars show FY26 4Q projections.
Three side-by-side stacked bar charts (finished goods, WIP, raw materials) split by power devices, LSI and others, each with a red months-on-hand line, short policy text above and FY24/FY25/FY26 ribbons below.
Free cash flow vs dividends from FY22 to FY26 plan: FCF 107, -592, -693, 98 and 238 億円; dividends 196, 192, 192, 192 and 193 億円, plus a 200 億円 buyback in FY23. Annual dividend held at 50 yen (25 interim, 25 year-end) each year; FY26 planned payout ratio 43%. Note on the 4-for-1 stock split effective September 30, 2023.
Five fiscal-year columns, each with payout and total return ratio boxes on top, paired FCF and dividend bars around a zero line, and a dividend-per-share table at the bottom; boxed stock-split note at left.
Section break introducing the structural reform program.
White slide with red vertical accent bar and single section title.
Structural reform moves into the results phase. Four pillars: SiC profitability (5th-generation devices, yield, early 6-to-8-inch shift, xEV and AI server growth), manufacturing and procurement cost cuts (gold-to-copper wire, power and material costs, site reorganization including selling one overseas site), pricing and portfolio optimization (gold price pass-through, exiting unprofitable products, new pricing system, lower overhead) and non-SiC sales growth. Operating profit improvement vs FY2025 targets: >400 億円 in FY2026, >700 in FY2027 and well over 1,000 in FY2028.
Four-row table with pillar names, bullet details and three columns of gradient bars by year; bottom row shows the target figures in grey, light red and deep red cells.
Section break introducing the silicon carbide power device business.
White slide with red vertical accent bar and single section title.
SiC sales from FY21 to FY26, with the main automotive inverter share rising fast. SiC business growth was +14% in FY25 and is planned at over +30% in FY26; SiC devices and modules (excluding substrates) grew +41% and are planned at over +55%. Drivers: HEV adoption as planned, a US major OEM selecting ROHM SiC modules for 2028 models, AI server power sales above plan, 5th-gen 8-inch SiC MOSFETs in mass production at Chikugo from October, and Miyazaki No. 2 plant 8-inch production brought forward one year to FY2027 2Q.
Left: clustered column chart (SiC total vs main inverter) with faded FY26 bars; right: YoY growth table with charcoal header and four bullet points.
Waterfall-style roadmap from the FY2025 loss to above break-even through substrate improvement, yield gains, device cost reduction (including volume) and portfolio improvement from new-generation devices and modules. ROHM aims to bring break-even forward one year from FY2028 to FY2027, helped by AI server demand and price increases from FY2026, the Miyazaki No. 2 fab starting in FY2027 and Chikugo's 6-inch line moving to 8-inch by FY2028.
Left: horizontal step chart with a red break-even line under a red header bar; right: charcoal header, five bullets, and photos of SiC wafers, modules and the Miyazaki plant.
Section break introducing ROHM's server and AI data center business.
White slide with red vertical accent bar and single section title.
ROHM is scaling adoption and new products for AI servers. Server sales of 170 億円 in FY25 are targeted at 300+ in FY26, 450+ in FY27, 600+ in FY28 and 1,000+ 億円 in FY30, raised from the plan announced in May 2026. Product lineup spans 800V DC power architecture: SiC MOSFETs, GaN HEMTs and Si MOSFETs for power, MPC + DrMOS, hot-swap controllers and SSD PMICs for analog, plus shunt resistors and silicon capacitors.
Left: stacked target bars by year (power devices, analog, others) with a previous-plan comparison; right: power architecture diagram (AC-DC, DC-DC, CPU/GPU, HDD/SSD) above a product grid with chip images and feature labels.
DrMOS sales are projected to grow from near zero in FY26 to more than 300 億円 by FY30 as rising GPU power consumption increases the number of DrMOS per board across current, next and next-next generation servers. Second-generation development is complete with adoption under review at major global customers, and work has started on a next-generation process.
Left: bar chart with a red GPU power curve, server generation ribbons and GPU board illustrations; right: first vs second generation arrow banners with product images and two red-square headlines.
Brand closing slide marking the end of the main presentation before the appendix.
White slide with a centered red ROHM Semiconductor logo and the 'Electronics for the Future' tagline.
1H sales 2,442 to 2,795 億円 (+14.4%). Automotive 1,141 to 1,314 (+15.2%, xEV +69), industrial 307 to 407 (+32.6%), consumer 597 to 564 (-5.5%, home appliances -29), communications 99 to 126 (+27.9%), computers & storage 299 to 384 (+28.5%, PC & servers +90), with sub-application contributions listed under each chart.
Six column panels with icon headers (total, automotive, industrial, consumer, communications, computers & storage), each with a two-bar chart, growth rate and an application-level change list.
Sales by customer nationality: Japan 1,298 to 1,476 (+13.8%), China 383 to 334 (-12.8%), other Asia 243 to 358 (+47.4%, C&S +64), Americas 281 to 364 (+29.5%), Europe 238 to 263 (+10.4%). Overseas sales ratio rose from 46.9% to 47.2%. Each region shows market-level contributions.
World-map background with five regional bar-chart panels placed by geography, each with a market contribution table; top banner with total sales and overseas ratio.
LSI sales 1,288 億円 (+12.8%) with segment profit 176 (13.6% margin, +35.5%); semiconductor devices sales 1,207 (+20.7%) with a loss of 44 (-3.6%), improved from a loss of 98; modules sales 164 (-4.4%) and profit 17 (10.4%); others sales 136 (+5.2%) and profit 18 (13.6%).
Financial table with four segments, each with sales, segment profit and margin rows; current-period column outlined in red, plus prior period, change amount and change rate columns.
Full-year plan 4,811 to 5,500 億円 (+14.3%). Automotive 2,368 to 2,608 (+10.1%, xEV +137), industrial 613 to 792 (+29.1%), consumer 1,054 to 1,075 (+1.9%), communications 183 to 220 (+20.1%), computers & storage 593 to 806 (+36.0%, PC & servers +214).
Same six-panel market layout as page 23 with full-year values.
Plan by region: Japan 2,523 to 2,930 (+16.1%, automotive +199, industrial +133), China 704 to 616 (-12.5%), other Asia 501 to 734 (+46.6%, C&S +149), Americas 559 to 668 (+19.4%), Europe 524 to 552 (+5.2%). Overseas sales ratio planned at 46.7% vs 47.6% in FY2025.
World-map layout matching page 24, with full-year values.
Quarterly sales 1,280 to 1,437 億円 (+12.3%). Automotive 602 to 666 (+10.6%), industrial 161 to 213 (+32.6%), consumer 313 to 297 (-4.9%), communications 54 to 70 (+29.2%), computers & storage 151 to 191 (+26.7%, PC & servers +48).
Six-panel market layout with quarterly figures.
2Q by region: Japan 682 to 763 (+11.9%), China 189 to 162 (-14.3%), other Asia 123 to 182 (+47.3%), Americas 147 to 190 (+29.7%), Europe 139 to 140 (+0.9%). Overseas sales ratio 46.9% vs 46.7% a year earlier.
World-map regional layout with quarterly values.
2Q operating profit rose 4 億円, from 75 to 79. Sales growth added +157 (FX +60, underlying +97), materials and inventory reduced -154 (materials -147, inventory -7) and fixed costs added +1 at ¥160.12/US$ vs ¥147.50.
Waterfall chart with summary tables under each step and a small red arrow for the increase.
2Q LSI sales 667 億円 (+12.2%) and profit 102 (15.4%); semiconductor devices sales 618 (+16.8%) and a loss of 34 (-5.6%); modules sales 83 (-9.0%) and profit 7 (8.2%); others sales 70 (+6.0%) and profit 9 (13.5%).
Segment table matching page 25, with the 2Q column outlined in red.
Quarter-on-quarter sales 1,357 to 1,437 億円 (+5.9%). Automotive 648 to 666 (+2.8%), industrial 194 to 213 (+10.1%), consumer 266 to 297 (+11.8%), communications 56 to 70 (+24.2%), computers & storage 193 to 191 (-1.4%).
Six-panel market layout comparing 1Q and 2Q.
QoQ by region: Japan 713 to 763 (+7.0%), China 172 to 162 (-5.7%), other Asia 176 to 182 (+3.4%), Americas 174 to 190 (+9.8%), Europe 123 to 140 (+13.7%). Overseas sales ratio 46.9% vs 47.5% in 1Q.
World-map regional layout comparing 1Q and 2Q.
2Q operating profit fell 17 億円 from 96 to 79 vs 1Q. Sales growth added +80 (FX -2, underlying +82), materials and inventory reduced -76 (materials -35, inventory -41) and fixed costs rose by 21.
Waterfall chart with a charcoal down-arrow for the decline and summary tables beneath.
Versus 1Q: LSI sales 621 to 667 (+7.3%) and profit 73 to 102 (+40.0%); semiconductor devices sales 589 to 618 (+4.8%) and loss widening from 9 to 34; modules sales 81 to 83 and profit 10 to 7; others sales 66 to 70 and profit 9.
Segment table matching pages 25 and 31, with 2Q vs 1Q columns.
이 슬라이드 및 기본 프레젠테이션 콘텐츠에 대한 일반적인 질문.
The slides are in Japanese. This is ROHM's own 決算説明会資料 (earnings briefing material) for the FY2026 first half, originally published on TDnet, the Tokyo Stock Exchange's Timely Disclosure system, on November 6, 2026. This page gives English translations of the slide titles and key figures.
ROHM's fiscal year runs from April to March, so FY2026 is April 2026 to March 2027. The first half (1H) in this deck is April to September 2026, and 2Q is July to September 2026.
億円 is the company's reporting unit and equals ¥100 million. For example, 1H sales of 2,795 億円 are about ¥279.5 billion, and the 500 億円 operating profit forecast is ¥50 billion.
1H sales were 2,795 億円 (+14.4% YoY), operating profit 175 億円 (+128.5%) and net profit 156 億円 (+51.0%). The full-year forecast was raised to 5,500 億円 sales and 500 億円 operating profit, up 200 億円 from the initial operating profit plan of 300 億円. The annual dividend is planned at 50 yen.
SiC device sales (excluding substrates) grew 55% YoY in 1H. 5th-generation 8-inch SiC MOSFETs began mass production at the Chikugo plant, the Miyazaki No. 2 plant's 8-inch production was brought forward to FY2027 2Q, and ROHM aims to reach SiC break-even one year early, in FY2027.
The results highlights table (page 3), the donut-chart sales mix (pages 4 and 8), the operating profit waterfall bridges (pages 5, 9, 10, 30 and 34), the weather-icon outlook table (page 7) and the structural reform target table (page 15) adapt easily to other companies' half-year or annual results decks.
Yes. The deck is available as a PDF and as an editable PPTX, so you can reuse the layouts, charts and tables, replace the data with your own, and translate the Japanese text.
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